Semiconductor Assembly and Packaging Equipment Market Set for Dynamic Growth: Projected to Reach USD 8.48 Billion by 2034
The global semiconductor assembly and packaging equipment market is entering a transformative phase, projected to expand from USD 3.62 billion in 2024 to USD 8.48 billion by 2034, registering a CAGR of 8.92% over the forecast period. This strong growth reflects the rising importance of advanced packaging solutions in enabling next-generation semiconductor...
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