U.S. Semiconductor Assembly and Packaging Equipment Market Poised for Robust Growth, Driven by Domestic Investments and Advanced Technologies
The U.S. semiconductor assembly and packaging equipment market is entering a period of substantial growth, forecasted to rise from USD 439.24 million in 2024 to USD 825.84 million by 2034. This growth, occurring at a CAGR of 6.53%, is largely attributed to the surge in federal investments, renewed emphasis on domestic chip production, and technological advancements...
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